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Through-hole technology promises smaller mobile phone cameras

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1 reviews

Apr, 2014

We have collected and analyzed 1 expert reviews from international sources. The average review date is Nov 8, 2007. We have compared these reviews to 780504 reviews from other Digital Compact Cameras. Last update: Apr 16, 2014.

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(Based on 1 reviews)

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Through-hole technology promises smaller mobile phone cameras

 

November 9, 2007 Oki has developed a new manufacturing technique that makes it possible to further miniaturize camera modules for mobile phones. The company announced it has started a contract assembly service for W-CSP (Wafer level Chip Sized Package)...

In order to miniaturize a camera module, it is necessary to miniaturize its image sensor. Oki's new W-CSP technology includes creating a through-hole in the silicon substrate such as an image sensor, and putting an electrode through the hole. By using...

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